The Radiation Hardened Electronics Market is anticipated to expand at a CAGR of 4.0% from USD 1.5 billion in 2022 to USD 1.8 billion by 2027. The market is expanding primarily as a result of rising intelligence, surveillance, and reconnaissance activities and rising need for electronic devices that can endure harsh nuclear conditions. The market for radiation-hardened electronics is expanding due in part to the use of mixed signal integrated circuits (ICs), processors and controllers, memory, and power management. RHBD and RHBP are two manufacturing processes that are fueling the market's expansion. The market for radiation-hardened electronics is also being driven by escalating technological developments in multicore processors for military and space-grade applications.

Key players in the radiation hardened electronics market are Microchip Technology Inc. (US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), Xilinx, Inc. (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). SMEs/startups covered in the study are Cobham Limited (UK), Analog Devices, Inc (US), Data Devices Corporation (US), 3D Plus (France), Mercury Systems, Inc. (US), PCB Piezotronics, Inc (US), Vorago (US), Micropac Industries, Inc (US), GSI technology, Inc (US), Everspin Technologies Inc (US), Semiconductor Components Industries, LLC (US), AiTech (US), Microelectronics Research Development Corporation (US), Space Micro, Inc (US), and Triad Semiconductor ( US).

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Increasing demand for radiation-hardened electronics in commercial satellites

The need for small satellites is increasing due to the increasing need for cost-effective satellite communication for a variety of uses, including military monitoring and surveillance, television content delivery, mobile phone connectivity, and farm surveillance. These commercial satellites are deployed into geosynchronous orbits for the best coverage and frequently have a lifespan of 15 to 20 years. The demand for radiation-hardened electronics equipment has increased as there are more communication satellites orbiting the globe. The launch of a mega constellation of thousands of low earth orbit satellites by new space entrepreneurs OneWeb, SpaceX, Amazon, and Telesat in the coming years to improve the global connectivity network has further increased the demand for radiation-hardened electronics systems in commercial satellites.

Increasing space missions globally

With nations investing extensively in creating cutting-edge technologies for space research, the global space sector has seen a huge increase in space missions. Due to this, there is an increase in demand for software models and radiation-hardened components that can increase the radiation tolerance of electronic components used in spacecraft. The US has an advantage over other nations in this aspect thanks to its capacity for production, testing infrastructure, and qualified labour. With programmes like the launch of Crew-4 by NASA and SpaceX in April 2022, which included an all-civilian crew for scientific objectives, the nation is concentrating on growing its commercial spaceship sector and space tourism.

Power electronics component to hold the largest size of radiation hardened electronics market during the forecast period

During the anticipated period, the market for radiation-hardened electronics is anticipated to be dominated by the power electronics component. Due to their high durability against high-energy charged particles and ionising radiation, MOSFET power electronics are increasingly being used in space and high-reliability applications, which is the main factor driving this growth. Companies like Infineon Technologies AG's subsidiary IR HiRel produce Si MOSFET devices that enhance system efficiency and lower cost per bit in high-throughput satellites. Manufacturers are continuously concentrating on accelerating the performance of MOSFET devices for space applications. The R9 MOSFET's broad selection of gate drivers and enhanced current capabilities assist satellite designers as well.

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COTS in product type segment is expected to grow at the fastest CAGR during the forecast period

The Commercial Off-The-Shelf (COTS) segment of the market for radiation-hardened electronics is anticipated to develop at the quickest CAGR during the projected period. The development of low-cost nanosatellites has boosted the growth prospects for COTS product types, which is what is driving this rise. Additionally, COTS provides appealing signal processing designs that further boost their uptake among military space missions. As ceramic packages that are pin-out compatible with COTS and provide the same functionality as the original device can be used in place of them, COTS presents a desirable option for reducing the cost in space applications. Significant cost savings are made as a result, and the risk and development time are decreased.

North America expected to dominate the radiation hardened market during the forecast period

Due to the rising need for radiation-hardened components in both commercial and military satellite applications, the North American region is anticipated to lead the market for radiation-hardened electronics over the forecast period. Reliable radiation-hardened microelectronics are needed by the US Department of Defence (DoD) and other private industries to support projects like satellites and nuclear modernisation activities. The US government makes ongoing efforts to preserve and improve domestic production capabilities for radiation-hardened microelectronic components. The US government awarded a permit in December 2021 to use Title III of the Defence Production Act (DPA) to improve and extend the domestic industry base for radiation-hardened microelectronics.

News Covered:

https://www.globenewswire.com/en/news-release/2023/01/31/2598365/0/en/Global-Radiation-Hardened-Electronics-Industry-Size-is-Anticipated-to-Gain-1-8-Bn-by-2027-at-a-CAGR-of-4-0.html

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