Advanced IC Packaging Market: An Exclusive Study on Upcoming Trends and Growth Opportunities


Posted July 26, 2022 by Lucintel

Lucintel has found the future of this market to be promising; the advanced IC packaging market is expected to reach $52.3 billion by 2027 with a CAGR of 5.7%.

 
Opportunities in the advanced IC packaging market have evolved through a number of stages i.e. Lucintel has found the future of this market to be promising; the advanced IC packaging market is expected to reach $52.3 billion by 2027 with a CAGR of 5.7%. In this market, flip-chip is expected to remain the largest packaging type, and consumer and communication segment is expected to remain the largest end use industry. Players can benefit from the available opportunities like the presence of large foundries and manufacturing hub for electronic devices.
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Amkor Technology, Taiwan Semiconductor, Advanced Semiconductor Engineering Technology, Intel Corporation, Samsung Electronics, JCET Group, Texas Instruments, Toshiba Corporation, and Renesas are some of the companies profiled in this report.
Some of the features of this report:
• Market size estimates: Advanced IC packaging market size estimation in terms of value ($M) shipment.
• Trend and forecast analysis: Market trend (2016-2021) and forecast (2022-2027) by various segments and regions.
• Segmentation analysis: Advanced IC packaging market size by packaging type, end use industry in terms of value and volume shipment.
• Regional analysis: Advanced IC packaging market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
• Growth opportunities: Analysis on growth opportunities in different packaging type, end use industry, and regions of advanced IC packaging in the advanced IC packaging market.
• Strategic analysis: This includes M&A, new product development, and competitive landscape of advanced IC packaging in the advanced IC packaging market.
• Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
Download Brochure of this report by clicking on https://www.lucintel.com/advanced-packaging-market.aspx
This exclusive report from Lucintel will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link [email protected]
About Lucintel
Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.
Brandon Fitzgerald
Lucintel
Dallas, Texas, USA
Email: [email protected]
Tel. 972.636.5056
Cell: 303.775.0751
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Contact Email [email protected]
Issued By Lucintel LLC
Phone +1-972-636-5056
Business Address Lucintel, 8951 Cypress Waters Blvd., Suite 160, Dallas, TX 75019
https://www.lucintel.com/advanced-packaging-market.aspx
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Categories Business
Tags advanced ic packaging market
Last Updated July 26, 2022