Silicon on Insulator (SOI) market research provides a new perspective into the components and workings of the global as well as regional levels. The report serving as an invaluable source of guidance for readers covers an analysis overview of the industry chain of the global market and discusses key elements associated with it, Silicon on Insulator (SOI) market. The report focuses on the global status, future forecast, growth opportunity, key market, and key players.
The global Silicon on Insulator (SOI) market size was estimated at USD 1.43 billion in 2023 and is projected to reach USD 3.64 billion in 2030 at a CAGR of 14.20% during the forecast period 2023-2030.
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Silicon-on-insulator (SOI) refers to a microchip or semiconductor device manufacturing technique in which engineers place thin films of monocrystalline silicon over an insulator to simplify integrated circuit manufacturing. This helps reduce the junction capacitance, which increases speed, eliminates charge leakage, and optimizes the performance of SOI-based devices while minimizing power consumption.
Because of these characteristics, they are widely used in the production of a variety of consumer electronics, microprocessors, radio frequency (RF) signal processors, biotechnological chips, and microelectromechanical systems. It is currently commercially available as a whole and partly used in silicon insulation types.
Top Key Competitors of Silicon on Insulator (SOI) market:
• Shin-Etsu Chemical
• SUMCO Corporation
• Soitec
• Globalwafers Co.
• STMicroelectronics N.V.
• GlobalFoundries
• Shanghai Simgui Technology
• Tower Semiconductor
• NXP Semiconductor Corp
• United Microelectronics Corporation
• Taiwan Semiconductor Manufacturing
• Vangaurd International Semiconductor Corporation
• Silicon Valley Microelectronics
• EV Group
• Ultrasil
• Murata Manufacturing Company Ltd.
• MagnaChip Semiconductor Corporation
• SunEdison
• IBM
• Virginia Semiconductor
• Qorvo, Inc
• Siltronic
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Silicon on Insulator (SOI) Market Segmentation:
By Wafer Size
• 200 mm
• 300 mm
By Wafer Type
• RF-SOI
• FD-SOI
• PD-SOI
• Others
By Technology
• Geocoding and reverse geocoding
• Data integration and ETL
• Reporting and visualization
• Others
By Product
• RF FEM
• MEMS
• Power
• Others
By Application
• Consumer Electronics
• Automotive
• Datacom & Telecom
• Others
By Thickness
• Thin-Film SOI wafers
• Thick-Film SOI wafers
• Others
Regional Level Scope
• North America,
• Europe,
• Asia-Pacific,
• South America, and
• Middle East, and Africa
Recent Developments:
• In December 2022, STMicroelectronics and Soitec collaborated on Silicon Carbide (SiC) substrates, with ST planning to adopt Soitec's SmartSiCTM technology for its 200mm substrate production over the next 18 months. This will feed ST's business of manufacturing devices and modules, with volume production expected in the medium term.
• In October 2022, Shin-Etsu Chemical launched the first silicone film emulsion that is low in volatile organic compounds (VOCs) and significantly reduces the presence of undesirable siloxanes, unlike previous silicone film-forming emulsions.
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