Semiconductor Assembly and Packaging Equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.

This report contains market size and forecasts of Semiconductor Assembly and Packaging Equipment in Global, including the following market information:



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Global Semiconductor Assembly and Packaging Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)


The global Semiconductor Assembly and Packaging Equipment market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.

The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.

Electroplating Equipment Segment to Reach $ Million by 2028, with a % CAGR in next six years.

The global key manufacturers of Semiconductor Assembly and Packaging Equipment include Advantest, Accrutech, Shinkawa, KLA-Tencor, Teradyne Inc., Amkor Technology, Tokyo Electron Limited, Lam Research Corporation and ASML Holding N.V, etc. In 2021, the global top five players have a share approximately % in terms of revenue.

We surveyed the Semiconductor Assembly and Packaging Equipment companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Semiconductor Assembly and Packaging Equipment Market, by Type, 2017-2022, 2023-2028 ($ millions)

Global Semiconductor Assembly and Packaging Equipment Market Segment Percentages, by Type, 2021 (%)



Electroplating Equipment
Inspection and Cutting Equipment
Lead Bonding Equipment
Chip Bonding Equipment
Others


Global Semiconductor Assembly and Packaging Equipment Market, by Application, 2017-2022, 2023-2028 ($ millions)

Global Semiconductor Assembly and Packaging Equipment Market Segment Percentages, by Application, 2021 (%)



Automotive
Enterprise Storage
Consumer Electronics
Healthcare Devices
Others


Global Semiconductor Assembly and Packaging Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)

Global Semiconductor Assembly and Packaging Equipment Market Segment Percentages, By Region and Country, 2021 (%)



North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa


Competitor Analysis

The report also provides analysis of leading market participants including:



Key companies Semiconductor Assembly and Packaging Equipment revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Semiconductor Assembly and Packaging Equipment revenues share in global market, 2021 (%)


Further, the report presents profiles of competitors in the market, key players include:



Advantest
Accrutech
Shinkawa
KLA-Tencor
Teradyne Inc.
Amkor Technology
Tokyo Electron Limited
Lam Research Corporation
ASML Holding N.V
Applied Materials
Toray Engineering
Kulicke & Soffa Industries
Hesse Mechatronics
Palomar Technologies
West Bond
DIAS Automation
Screen Holdings Co. Ltd
Hitachi High-Technologies Corporation
HYBONDASM Pacific Technology
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Table of content

1 Introduction to Research & Analysis Reports
1.1 Semiconductor Assembly and Packaging Equipment Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Semiconductor Assembly and Packaging Equipment Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Semiconductor Assembly and Packaging Equipment Overall Market Size
2.1 Global Semiconductor Assembly and Packaging Equipment Market Size: 2021 VS 2028
2.2 Global Semiconductor Assembly and Packaging Equipment Market Size, Prospects & Forecasts: 2017-2028
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top Semiconductor Assembly and Packaging Equipment Players in Global Market
3.2 Top Global Semiconductor Assembly and Packaging Equipment Companies Ranked by Revenue
3.3 Global Semiconductor Assembly and Packaging Equipment Revenue by Companies
3.4 Top 3 and Top 5 Semiconductor Assembly and Packaging Equipment Companies in Global Market, by Revenue in 2021
3.5 Global Companies Semiconductor Assembly and Packaging Equipment Product Type

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