The Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) market size is estimated to reach billions by 2026. Furthermore, it is poised to grow at a CAGR of XX% over the forecast period of 2021-2026. The Hybrid Memory Cube (HMC) is the high-performance RAM interface through-silicon via (TSV) technology by connecting the multiple memory arrays to the top of one another. It uses standard DRAM cells for memory implementation. The High-bandwidth Memory (HBM) is also the RAM interface but for 3D stacked SDRAM. It is used in combination with network devices and graphic accelerators. Both memory bus is capable of providing higher bandwidth with lower power consumption. It is widely applicable in graphics designing, in the field of networking, and others.
Major factors driving the growth of the HMC and HBM market include the growing need for high-bandwidth, low power consuming, and highly scalable memories, increasing adoption of artificial intelligence, and rising trend of miniaturization of electronic devices.
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Market Segmentation
By product type, the market for APU to grow at the highest CAGR during the forecast period.
The market for APUs is expected to grow at the highest rate during the forecast period. HBM-based APUs are a recent innovation by AMD (US) developed to meet the requirements of high-performance computing. APUs integrate both GPU and CPU capabilities on a single SoC. This further improves the overall energy efficiency of APUs by eliminating connections between chips. APUs can also be used for graphics applications. Moreover, AMD (US), the leading manufacturer of APUs, demonstrated an APU with integrated HBM and stacked non-volatile memory cells. This will also serve to drive the adoption of APUs in computing applications.
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By Application, HMC and HBM market for graphics applications to grow at the highest CAGR during the forecast period
The HMC and HBM market for graphics applications is expected to grow at the highest CAGR during the forecast period. A majority of the products available in the market with the HBM technology are GPU products. HBM was initially adopted in GPUs specifically for graphics applications. For instance, AMD (US) developed the HBM technology along with SK Hynix (South Korea) to be used in GPUs. Along with GPUs, APUs have also been introduced in the market that is increasingly being used for gaming applications. The increasing adoption of HMC and HBM in gaming is largely due to the increasing requirements to process vast amounts of pixels for larger screens and support higher compute rates for more stabilization to support high-end gaming.
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Key Market Players
Samsung (South Korea), Micron (US), SK Hynix (South Korea), Intel (US), Advanced Micro Devices (AMD) (US), Xilinx (US), Fujitsu (Japan), NVIDIA (US), IBM (US), Open-Silicon, Inc. (US)

TOC:
Chapter 1 Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market Overview
1.1 Product Overview and Scope of Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM)
1.2 Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market Segmentation By Type
1.2.1 APU
1.3 Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market Segmentation by End Use
1.3.1 HMC
1.3.2 HBM
TOC Continued…
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