Watsonville, CA – Nisene Technology Group, Inc., the foremost global leader in automated decapsulation, is proud to announce the latest addition to its remarkable lineup—the PlasmaEtch Decapsulation System. This breakthrough innovation comes as a timely response to the growing challenges within the semiconductor industry, bridging the gap between semiconductor manufacturing technology and failure analysis.

With the industry witnessing a global shift towards eco-friendly practices and a drive for smaller and more intricate components, failure analysts are often confronted with complex challenges. The PlasmaEtch system addresses these challenges head-on, integrating a patented gas-based semiconductor etching system (US patent number 9,548,227). By employing microwaved gases to initiate chemical radicals for isotropic etching, PlasmaEtch stands as the most environmentally sustainable and cost-efficient solution in semiconductor failure analysis.

Nisene's PlasmaEtch has ushered in an era of high precision and adaptability, capable of handling an expansive range of sample sizes, encapsulant types, and wire bond variations. This versatile approach ensures safety and reliability, whether dealing with traditional gold wire samples or the more intricate copper or silver wire samples.

Central to the PlasmaEtch system's prowess are its groundbreaking innovations. These encompass the pioneering afterburner downstream-focused plasma etching, meticulous mass flow control for all gases, ensuring zero microwave radiation exposure during the etching phase, and optimized low-temperature etching. Unlike conventional systems that often involve protracted durations to unveil the die's surface, the PlasmaEtch promises to reveal the entire die surface and wire layout within mere hours, setting a benchmark in efficiency.

"The PlasmaEtch represents not just an advancement in technology, but a commitment to the future of semiconductor manufacturing," said a spokesperson for Nisene Technology Group, Inc. "We are proud to pioneer a solution that not only meets the industry's demands but does so with an unwavering focus on sustainability and precision."

The PlasmaEtch system champions user-centricity with its highly customizable etch recipes, enabling the etching of various package types. Its fully chemical-free decapsulation process, environment-friendly blueprint, intuitive touchscreen interface, and PC/Windows-based graphical user interface set it apart from its contemporaries. It's worth highlighting that the PlasmaEtch is singularly efficient in etching samples with silver wires, all within a compact design optimal for tabletop utilization.

Fore more information visit us: https://www.nisene.com/

About Nisene Technology Group, Inc.

Nisene Technology Group, Inc. is a leading innovator in the realm of automated decapsulation, having served various industries for over four decades with their state-of-the-art systems. Their commitment to advancing technology ensures they remain at the vanguard of the semiconductor industry, meeting its ever-evolving demands with precision, reliability, and eco-conscious solutions.

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