Watsonville, CA: Nisene Technology Group, Inc., a pioneering leader in semiconductor decapsulation systems, has launched a groundbreaking series of acid etching and decapping tools designed for the semiconductor industry. The introduction of these advanced tools promises to enhance microfabrication processes and strengthen analytical capabilities in integrated circuit (IC) manufacturing.

Nisene Technology’s latest offerings, the PlasmaEtch MIP system and the JetEtch Pro decapsulation system, represent significant advancements in semiconductor manufacturing. The PlasmaEtch MIP system is noted for its safe and reliable etching process, which eliminates the need for ultrasonic cleaning and thus preserves the integrity of delicate bond structures. Meanwhile, the JetEtch Pro decapsulation system sets a new standard in performance with its automated and user-specified chemical solutions for mold compound removal.

“Acid etching and decapping are essential processes in IC manufacturing, shaping the very circuits that power our modern devices,” explained a spokesperson from the company. “Our PlasmaEtch and JetEtch systems can meet the highest standards of precision and safety, offering unmatched reliability and performance in the semiconductor industry. These tools streamline the manufacturing process and empower engineers and researchers with unprecedented access to the inner workings of integrated circuits.”

Acid etching, a process involving a corrosive acid solution to remove material from a surface selectively, is utilized extensively in microfabrication to pattern silicon wafers during IC manufacturing. This method allows for the high precision necessary for intricate circuit features and offers versatility across various materials, making it indispensable in electronics and beyond.

Decapping tools, which focus on removing the protective encapsulation around finished ICs, facilitate access to the internal layers of the chip for analysis. These tools are crucial for reverse engineering, security research, and failure analysis, providing insights into the design and functionality of chips and identifying potential vulnerabilities.

Nisene Technology has long been at the forefront of innovation in automated decapsulation. Its JetEtch Pro system, in particular, plays a vital role in semiconductor failure analysis and counterfeit protection. By exposing the die within an integrated circuit, this system enables verification of part authenticity and facilitates a wide range of tests critical to failure analysis. Since the 1970s, when the original Jet Etch system was introduced, the company has continually evolved its product line by integrating into the latest technological advancements.

About Nisene Technology Group, Inc

Nisene Technology Group, Inc. remains dedicated to leading the industry with cutting-edge solutions that address the needs of various emerging packages and materials used in semiconductor manufacturing. Its mission is to supply the semiconductor industry with tools that are not only effective but also safe and reliable, meeting the rigorous demands of modern IC manufacturing. The company’s focus on innovation and quality assurance makes it the go-to provider for semiconductor decapsulation tools worldwide.

Contact Details-

Phone Number- (831) 761-7980

Fax- (831) 761-2992

Address- 417-A Salinas Road Watsonville CA, 95076 United States of America

Website- https://www.nisene.com