Global semiconductor & IC packaging market is anticipated to grow at a significant CAGR of 14.9% during the forecast period (2024-2031). The market growth is attributed to the increasing demand of the consumer electronics, growing miniaturization and densification in the electronic sector and adoption of emerging technologies such as 5G and autonomous vehicles. Government support with funds helps various R&D projects and facilitates access to essential semiconductor infrastructure and resources to drive innovation and enhance local talent development. For instance, in June 2023, Micron Technology, Inc. announced plans to build a new semiconductor assembly and test facility in India with an investment of $825.0 million over the two phases of the project. The investment for both phases is up to $2.7 billion under the government's modified assembly, testing, marking, and packaging (ATMP) Scheme.

Increasing semiconductor manufacturing packaging approach provides customers with access to an efficient, localized, and secure supply of semiconductors through a dedicated production facility For instance, In December 2023, Pragmatic Semiconductor announced that it had completed the first close of its Series D funding round, securing an investment of £162.0 million ($201.5 million). The investment enables Pragmatic to accelerate its expansion plans in the UK to meet the growing demand for its unique packaging technology from customers globally.

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Market Coverage

The market number available for – 2023-2031
Base year- 2023
Forecast period- 2024-2031

Segment Covered- 

By Type
By Technology
By Packaging Platform
By End-Users

Regions Covered-

North America
Europe
Asia-Pacific
Rest of the World

Competitive Landscape- Intel Corp., Micron Technology, Inc., NVIDIA Corp., Renesas Electronics Corp., Taiwan Semiconductor Manufacturing Company Ltd. among others.

Semiconductor & IC Packaging Market Report Segment

By Type

Organic substrate
Bonding wires
Leadframes
Encapsulation resins
Ceramic packages
Die attach materials
Thermal interface materials
Solder balls
Others

By Technology

Small outline package (SOP)
Grid array (GA)
Quad flat no-leads (QFN)
Dual Flat No-leads (DFN)
Quad flat packages (QFP)
Dual-in-line (DIP)

By Packaging Platform

Flip Chip
System in a Package (SIP)
5D/3D
Embedded Die
Fan-in Wafer Level Packaging (FI-WLP)
Fan-out Wafer Level Packaging (FO-WLP)

By End-Users

Consumer Electronics
Automotive
Aerospace & Defence
IT & Telecommunication
Healthcare
Others (Energy and Lighting)

A full Report of Semiconductor & IC Packaging Market is Available @  https://www.omrglobal.com/industry-reports/semiconductor-and-ic-packaging-market

Semiconductor & IC Packaging Market Report Segment by Region

North America                                                                                                           

United States
Canada

Europe

UK
Germany
Spain
France
Italy
Rest of Europe

Asia-Pacific

India
China
Japan
South Korea
Rest of APAC

Rest of the World

Latin America
Middle East and Africa

Company Profiles

Advanced Micro Devices, Inc.
Amkor Technology, Inc
Analog Devices, Inc.
Applied Materials, Inc.
ASML Holding N.V (ASML)
Broadcom Inc.
Infineon Technologies AG
Intel Corp.
Marvell Technology, Inc.
MediaTek Inc.
Micron Technology, Inc.
NXP Semiconductors N.V.
Qualcomm Technologies, Inc.
Samsung Electronics Co., Ltd.
Silicon Laboratories, Inc.
SK hynix Inc.
STMicroelectronics N.V.
Synaptics Inc.
Texas Instruments Inc.

Reasons to buy from us –

We cover more than 15 major industries, further segmented into more than 90 sectors.
More than 120 countries are for analysis.
Over 100+ paid data sources mined for investigation.
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