Lucintel's latest market report analyzed that power module provides attractive opportunities in transportation, industrial, wind energy, solar PV, and others. The power module market is expected to reach $12.6 billion by 2027 with a CAGR of 12.6%. In this market, IGBT is the largest segment by product type, whereas transportation is largest by end use industry. The emergence of IGBT high power modules and development of high temperature SiC power module provides strategic growth path in this market.
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Based on product type, the power module market is segmented into IGBT, FET, SiC, and others. The IGBT segment accounted for the largest share of the market in 2021 and is expected to register the highest CAGR during the forecast period, due to its increasing demand in various power electronics applications, such as inverters, converters and power supplies.
Browse in-depth TOC on “Power Module Market”
71 – Tables
72 – Figures
163 – Pages
The Power Module Market is marked by the presence of several big and small players. Some of the prominent players offering power module include Infineon Technologies AG, STMicroelectronics, ON Semiconductor, Mitsubishi Electric Corporation, Toshiba, Vincotech, Hitachi, Fuji Electric, Semikron, and Danfoss.
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This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link [email protected].
About Lucintel
Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.
Brandon Fitzgerald
Lucintel
Dallas, Texas, USA
Email: [email protected]
Tel. 972.636.5056
Cell: 303.775.0751
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