Watsonville, CA: In response to the growing demand for eco-friendly semiconductor manufacturing processes and the intricate need for failure analysis in the semiconductor industry, Nisene Technology Group, Inc. has introduced the PlasmaEtch decapsulation system. This advanced technology promises a greener, more efficient, and highly effective method for semiconductor decapsulation processes.

Plasma etching is a microfabrication process critical for selectively removing materials from a substrate using plasma. This technique is vital for creating smaller parts with delicate internal components. The PlasmaEtch system distinguishes itself with its patented gas-based etching process, which employs microwave-induced plasma (MIP) for isotropic etching, making it a superior choice for environmental consciousness and cost efficiency.

The semiconductor industry is at a crossroads, with an increasing demand for miniaturized components and a push for sustainable manufacturing practices. Addressing this dual challenge, Nisene Technology implements laser decap technologies to meet the intricate requirements of semiconductor manufacturing and failure analysis.

"PlasmaEtch system can handle a wide variety of package types and wire materials, including the challenging silver wires, without the use of chemicals," said a spokesperson for the company. "This reinforces our commitment to innovation and environmental responsibility."

The innovative system boasts a series of breakthroughs, including Afterburner downstream-focused plasma etching, precision mass flow control for all gases, and an assurance that samples are not exposed to microwave radiation during the etching process. The low-temperature, isotropic etching process is uniquely capable of swiftly and effectively decapsulating a vast array of sample sizes, encapsulant types, and wire bond types.

Compared to traditional plasma decap systems, which may take extensive periods to expose the die surface, the PlasmaEtch can reveal the complete die surface and wire sweep in just a few hours. With highly customizable etch recipes, a comprehensive touch-screen interface, and a PC/Windows-based graphical user interface, the PlasmaEtch is designed for ease of use and efficiency, all within a compact footprint ideal for laboratory settings. This accomplishment signifies a significant step forward in chemical-free decapsulation.

About Nisene Technology Group, Inc:

Nisene Technology Group, Inc. has pioneered automated decapsulation since the 1970s and has developed an extensive portfolio of decapsulation systems over the past four decades. The PlasmaEtch system embodies the culmination of years of expertise, research, and a deep understanding of the needs of the semiconductor manufacturing and failure analysis sectors. As the world leader in automated decapsulation, Nisene Technology Group, Inc. continues to drive innovation, ensuring that the semiconductor industry can meet today's and tomorrow's challenges.

Contact Details:

Phone Number- (831) 761-7980

Fax- (831) 761-2992

Address- 417-A Salinas Road Watsonville CA, 95076 United States of America

Website- https://www.nisene.com/